Diamond Sawing

Applications

General

  • Optical alignment and diamond sawing of most hard and brittle materials
  • Odd waste strip (alley) circuit stepping
  • Mixed circuit types on a plate
  • Economical prototype and volume production quantities
  • Combined with laser cutting to produce intricate contours

Types

Microwave Hybrid Circuit Substrates

  • Thin Film

Conventional Hybrid Circuit Substrates

  • Thick Film
  • Direct Bond Copper

Ceramic Microcircuit Package Components

  • Co-fired
  • Thick Film

Typical Hybrid Application Uses

Optically align and cut through via castellations to form circuit or package edge
Optically align to thin or thick film metalization patterns to accurately define substrate edge
Precision edged finished circuit blanks
Precision heat spreaders and mount tabs