Applications
General
- Optical alignment and diamond sawing of most hard and brittle materials
- Odd waste strip (alley) circuit stepping
- Mixed circuit types on a plate
- Economical prototype and volume production quantities
- Combined with laser cutting to produce intricate contours
Types
Microwave Hybrid Circuit Substrates
- Thin Film
Conventional Hybrid Circuit Substrates
- Thick Film
- Direct Bond Copper
Ceramic Microcircuit Package Components
- Co-fired
- Thick Film
Typical Hybrid Application Uses
Optically align and cut through via castellations to form circuit or package edge
Optically align to thin or thick film metalization patterns to accurately define substrate edge
Precision edged finished circuit blanks
Precision heat spreaders and mount tabs
