General

• Optical alignment and diamond sawing of most hard and brittle materials
• Odd waste strip (alley) circuit stepping
• Mixed circuit types on a plate
• Economical prototype and volume production quantities
• Combined with laser cutting to produce intricate contours

Types
Microwave Hybrid Circuit Substrates

• Thin Film

Conventional Hybrid Circuit Substrates

• Thick Film
• Direct Bond Copper

Ceramic Microcircuit Package Components

• Co-fired
• Thick Film

Typical Hybrid Application Uses

• Optically align and cut through via castellations to form circuit or package edge
• Optically align to thin or thick film metalization patterns to accurately define substrate edge
• Precision edged finished circuit blanks
• Precision heat spreaders and mount tabs