Diamond Sawing



  • Optical alignment and diamond sawing of most hard and brittle materials
  • Odd waste strip (alley) circuit stepping
  • Mixed circuit types on a plate
  • Economical prototype and volume production quantities
  • Combined with laser cutting to produce intricate contours

Microwave Hybrid Circuit Substrates

  • Thin Film

Conventional Hybrid Circuit Substrates

  • Thick Film
  • Direct Bond Copper

Ceramic Microcircuit Package Components

  • Co-fired
  • Thick Film

Typical Hybrid Application Uses

  • Optically align and cut through via castellations to form circuit or package edge
  • Optically align to thin or thick film metalization patterns to accurately define substrate edge
  • Precision edged finished circuit blanks
  • Precision heat spreaders and mount tabs