General

• Modify Standard Microcircuit Packages to Custom Configuration inexpensively
• Isolation of up to 1000 M
  Ω
• Create Complex Pad Shapes
• No hard tooling charge or non-recurring engineering charge
• No tooling impact for design changes
• Economical small lot quantities or production runs

Types

• Co-fired Packages
• Thick Film Packages
• Thin Film Packages

Uses

• Prototyping
• Short Run Production or Volume
• Removal of Plating Buss Bars

Materials

Alumina Packages
Gold, Silver, Copper Or Nickel Conductors

Typical Buss Removal Application